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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

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    Buy cheap ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices from wholesalers
     
    Buy cheap ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices from wholesalers
    • Buy cheap ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices from wholesalers

    ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

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    Supply Ability : 200,000+ m² PCB per Month
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    ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

    Tg170 Multilayer Board(3+4+3) HDI PCB Wearable Devices


    ♦ What is HDI PCB?


    HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.



    Characteristics of HDI PCB

      • High circuit density
      • Miniaturization and thinness
      • Excellent signal integrity
      • Good heat dissipation performance
      • High reliability
      • A variety of laminate structures are available

    Applications of HDI PCB


    Widely used in fields with high requirements on circuit board size, performance and reliability, such as smart phones, tablet computers, laptops, automotive electronics, medical equipment, aerospace, communication equipment, etc.


    Technical Parameters


    Item

    Spec

    Layers

    1~64

    Board Thickness

    0.1mm-10 mm

    Material

    FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

    Max Panel Size

    800mm×1200mm

    Min Hole Size

    0.075mm

    Min Line Width/Space

    Standard: 3mil(0.075mm) Advance: 2mil

    Board Outline Tolerance

    0.10mm

    Insulation Layer Thickness

    0.075mm--5.00mm

    Out Layer Copper Thickness

    18um--350um

    Drilling Hole (Mechanical)

    17um--175um

    Finish Hole (Mechanical)

    17um--175um

    Diameter Tolerance (Mechanical)

    0.05mm

    Registration (Mechanical)

    0.075mm

    Aspect Ratio

    17:01

    Solder Mask Type

    LPI

    SMT Min. Solder Mask Width

    0.075mm

    Min. Solder Mask Clearance

    0.05mm

    Plug Hole Diameter

    0.25mm--0.60mm


    One-Stop PCBs Solution

    PCB PrototypeFelx PCBRigid-Flex PCBCeramic PCB
    Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

    Advantages of DQS Team
    1. On-time Delivery:
      • Owned PCBA factories 15,000 ㎡
      • 13 fully automatic SMT lines
      • 4 DIP assembly lines

    2. Quality Guaranteed:

      • IATF, ISO, IPC, UL standards
      • Online SPI, AOI, X-Ray Inspection
      • The qualified rate of products reach 99.9%

    3. Premium Service:

      • 24H reply your inquiry;
      • Perfect after-sales service system;
      • From prototype to mass production

    Quality ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices for sale
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