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Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias

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    Buy cheap Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias from wholesalers
     
    Buy cheap Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias from wholesalers
    • Buy cheap Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias from wholesalers

    Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias

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    Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias


    10 Layer Multilayer HDI Circuit Board 0.4mm Half Plating Vias PCB


    ♦ What ​​is Blind Hole in PCBs?


    Half Plating Vias​​ (also called ​​Partial Plating Vias​​ or ​​Non-Through Plating Vias​​) are a type of via structure used in printed circuit board (PCB) design where the conductive plating does not fully extend through the entire via hole.


    ​​Key Characteristics:​​

      1. ​​Partial Copper Plating​​:

        • Unlike standard ​​fully plated through-hole vias​​, half-plated vias have copper plating only on one side or a portion of the via wall, leaving the other side unplated or partially plated.
      2. ​​Controlled Depth Plating​​:

        • The plating may stop at a certain depth, either by laser drilling, controlled electroplating, or plugging material (e.g., resin).
      3. ​​Common Applications​​:

        • ​​Blind/Buried Vias​​: Used in HDI (High-Density Interconnect) PCBs to connect inner layers without passing through the entire board.
        • ​​Via-in-Pad Designs​​: Helps prevent solder wicking into the via during assembly.
        • ​​RF/Microwave PCBs​​: Reduces parasitic capacitance and improves signal integrity.
        • ​​Thermal Management​​: Used in thermal vias to control heat dissipation.

    Manufacturing Methods:​

      • ​​Laser Drilling + Plating​​: Laser creates a cavity, followed by selective plating.
      • ​​Plugging & Partial Plating​​: Filling part of the via with dielectric material before plating.
      • ​​Sequential Lamination​​: Used in HDI PCBs to create buried or blind half-plated vias.


    ♦ ​​​​Comparison with Other Via Types?​


    ​Via Type​​Plating Coverage​​Usage​
    ​Through-Hole Via​Fully plated (entire hole)Standard PCBs
    ​Blind Via​Plated from surface to inner layerHDI PCBs
    ​Buried Via​Plated between inner layersMultilayer PCBs
    ​Half Plating Via​Partially plated (one side or depth-controlled)Specialized designs

    ♦ ​​Conclusion

    Half plating vias are an advanced PCB design technique used to optimize space, signal performance, and manufacturability in complex multilayer boards, especially in high-frequency and miniaturized electronics.


    Technical Parameters


    Item

    Spec

    Layers

    1~64

    Board Thickness

    0.1mm-10 mm

    Material

    FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

    Max Panel Size

    800mm×1200mm

    Min Hole Size

    0.075mm

    Min Line Width/Space

    Standard: 3mil(0.075mm) Advance: 2mil

    Board Outline Tolerance

    士0.10mm

    Insulation Layer Thickness

    0.075mm--5.00mm

    Out Layer Copper Thickness

    18um--350um

    Drilling Hole (Mechanical)

    17um--175um

    Finish Hole (Mechanical)

    17um--175um

    Diameter Tolerance (Mechanical)

    0.05mm

    Registration (Mechanical)

    0.075mm

    Aspect Ratio

    17:01

    Solder Mask Type

    LPI

    SMT Min. Solder Mask Width

    0.075mm

    Min. Solder Mask Clearance

    0.05mm

    Plug Hole Diameter

    0.25mm--0.60mm


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    Quality Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias for sale
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