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High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

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    Buy cheap High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones from wholesalers
     
    Buy cheap High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones from wholesalers
    • Buy cheap High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones from wholesalers

    High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

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    High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones


    12 Layer 3OZ High Density Interconnect HDI PCB


    ♦ What is High Density PCB (HDI PCB)?


    A ​​High Density Interconnect (HDI) PCB​​ is an advanced printed circuit board designed to accommodate ​​more components in a smaller space​​ by using ​​finer traces, smaller vias, and higher connection density​​ than traditional PCBs. HDI technology enables ​​miniaturization, improved signal integrity, and enhanced performance​​ in modern electronics.



    ♦ ​​​​Key Features of HDI PCBs​​​:


    ✅ ​​Finer Trace Width/Spacing​​ (≤ 100µm, vs. standard 150µm+).

    ✅ ​​​Microvias​​ (laser-drilled, < 150µm diameter) for high-density interconnects.

    ✅ ​​​​Blind & Buried Vias​​ (instead of through-hole vias) to save space.

    ✅ ​​Thinner Dielectric Materials​​ (for compact layer stacking).

    ✅ ​​Higher Layer Count​​ (often 8+ layers in a slim profile).

    ✅ ​​​Advanced Materials​​ (low-loss dielectrics for high-speed signals).


    ♦ ​​HDI PCB vs. Standard PCB: Key Differences​​?​


    Feature​HDI PCB​​Standard PCB​
    ​Trace Width​≤ 100µm (can go down to 40µm)≥ 150µm
    ​Via Size​Microvias (50–150µm)Through-hole vias (≥ 300µm)
    ​Via Types​Blind, buried, stackedMostly through-hole
    ​Layer Count​8+ (with thin dielectrics)Typically 2–12 layers
    ​Signal Speed​Optimized for high-speed signalsLimited high-speed performance
    ​Applications​Smartphones, wearables, aerospaceConsumer electronics, power circuits

    ♦ ​​​​Types of HDI PCBs​​​​:

      1. ​​1+N+1​​ – Single HDI layer (microvias on outer layers).
      2. ​​2+N+2​​ – Two HDI layers (stacked microvias).
      3. ​​3+N+3​​ – Three or more HDI layers (ultra-high density, used in advanced chips).
      4. ​​Any-Layer HDI​​ – Microvias can be placed anywhere (used in smartphones like iPhones).

    Technical Parameters


    Item

    Spec

    Layers

    1~64

    Board Thickness

    0.1mm-10 mm

    Material

    FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

    Max Panel Size

    800mm×1200mm

    Min Hole Size

    0.075mm

    Min Line Width/Space

    Standard: 3mil(0.075mm) Advance: 2mil

    Board Outline Tolerance

    士0.10mm

    Insulation Layer Thickness

    0.075mm--5.00mm

    Out Layer Copper Thickness

    18um--350um

    Drilling Hole (Mechanical)

    17um--175um

    Finish Hole (Mechanical)

    17um--175um

    Diameter Tolerance (Mechanical)

    0.05mm

    Registration (Mechanical)

    0.075mm

    Aspect Ratio

    17:01

    Solder Mask Type

    LPI

    SMT Min. Solder Mask Width

    0.075mm

    Min. Solder Mask Clearance

    0.05mm

    Plug Hole Diameter

    0.25mm--0.60mm


    One-Stop PCBs Solution

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    Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

    Advantages of DQS Team
    1. On-time Delivery:
      • Owned PCBA factories 15,000 ㎡
      • 13 fully automatic SMT lines
      • 4 DIP assembly lines

    2. Quality Guaranteed:

      • IATF, ISO, IPC, UL standards
      • Online SPI, AOI, X-Ray Inspection
      • The qualified rate of products reach 99.9%

    3. Premium Service:

      • 24H reply your inquiry
      • Perfect after-sales service system
      • From prototype to mass production

    Quality High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones for sale
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