BGA Circuit Board Assembly for Industrial Control

♦ What Is BGA Assembly?

BGA (Ball Grid Array) assembly​​ is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:

• • ​​Higher density connections​​ (more I/O in a smaller space)
  • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
  • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

♦ Key Features of Contract Manufacturing:

1. 1. ​​Solder Paste Application​​ – A stencil deposits solder paste onto PCB pads.
   2. ​​BGA Placement​​ – A pick-and-place machine positions the BGA component accurately.
   3. ​​Reflow Soldering​​ – The PCB is heated in a reflow oven, melting the solder balls to form connections.
   4. ​​Inspection & Testing​​ – X-ray inspection (AXI) checks for alignment and solder joint quality.

​​♦ Common Challenges in BGA Assembly:

• • ​​Solder joint defects​​ (voids, bridging, cold joints)
  • ​​Difficulty in rework/repair​​ (due to hidden solder joints)
  • ​​Thermal management​​ (BGAs can generate heat, requiring proper PCB design)

♦ Technical Parameters

DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production.

Our products include single, double, multi, high frequency, aluminum base, copper base, FR-4 and other high precision circuit boards.

We have over 10 years of experience in serving many domestic and foreign brand customers in a wide range of fields such as Medical, Automotive, Industrial Automation, Artificial Intelligence, Smart Home, Security, Power and Communications, etc..