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High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified

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High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified

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Certification :	ISO, UL, IPC, Reach
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Delivery Time :	5-30 days

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High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified

High-Precision BGA Assembly Services with IPC-A-610 Certified

♦ What Is BGA Assembly Service?

BGA Assembly Services refer to specialized PCB (Printed Circuit Board) assembly processes designed to handle Ball Grid Array (BGA) components, a type of advanced surface-mount packaging used in modern electronics.

♦ Key Features of BGA Assembly Services:

BGA Soldering
- Uses reflow soldering to attach BGA components, where solder balls melt to form electrical connections.
- Requires precise temperature control to prevent defects like voids or cold joints.
High-Density PCB Support
- BGAs allow for more connections in a smaller space, making them ideal for compact, high-performance devices (e.g., CPUs, GPUs, smartphones, IoT devices).
Advanced Inspection & Testing
- X-ray inspection (AXI) checks for hidden solder defects (e.g., bridging, misalignment).
- Electrical testing ensures functionality.
BGA Rework & Repair
- Reballing: Replacing damaged solder balls.
- Replacement: Removing and replacing faulty BGAs without damaging the PCB.
Materials & Techniques
- Underfill epoxy (for mechanical stability in high-stress environments).
- Controlled atmosphere soldering (to reduce oxidation).

♦ Why Are BGA Assembly Services Important?

- Complexity: BGAs are harder to solder than traditional components (e.g., QFP, SOIC) due to hidden solder joints.
- Reliability: Proper assembly prevents failures in critical applications (medical, aerospace, automotive).
- Miniaturization: Supports high-density designs in modern electronics.

DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ Application Fields


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

Product Tags:

electronic BGA Assembly

IPC-A-610 BGA Assembly

IPC-A-610 electronic prototype board

High Precision BGA Assembly Electronic Prototype Board IPC-A-610 Certified

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