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Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized

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    Buy cheap Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized from wholesalers
     
    Buy cheap Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized from wholesalers
    • Buy cheap Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized from wholesalers

    Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized

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    Certification : ISO, UL, IPC, Reach
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    Payment Terms : T/T
    Delivery Time : 5-30 days
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    Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized


    Medical Motherboard BGA Assembly


    What Is BGA Assembly?


    BGA (Ball Grid Array) assembly​​ is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:

      • ​​Higher density connections​​ (more I/O in a smaller space)
      • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
      • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

    Key Features of Contract Manufacturing:

      1. ​​Solder Paste Application​​ – A stencil deposits solder paste onto PCB pads.
      2. ​​BGA Placement​​ – A pick-and-place machine positions the BGA component accurately.
      3. ​​Reflow Soldering​​ – The PCB is heated in a reflow oven, melting the solder balls to form connections.
      4. ​​Inspection & Testing​​ – X-ray inspection (AXI) checks for alignment and solder joint quality.

    ​​♦ Common Challenges in BGA Assembly:

      • ​​Solder joint defects​​ (voids, bridging, cold joints)
      • ​​Difficulty in rework/repair​​ (due to hidden solder joints)
      • ​​Thermal management​​ (BGAs can generate heat, requiring proper PCB design)

    Technical Parameters


    PCB Assembly Capability

    Item

    Normal

    Special

    SMT

    Assembly

    PCB(used for SMT)

    specification

    Length and Width( L* W)

    Minimum

    L≥3mm, W≥3mm

    L<2mm

    Maximum

    L≤800mm, W≤460mm

    L > 1200mm, W>500mm

    Thickness( T)

    Thinnest

    0.2mm

    T<0.1mm

    Thickest

    4 mm

    T>4.5mm

    SMT components specification

    Outline Dimension

    Min size

    0201(0.6mm*0.3mm)

    01005(0.3mm*0.2mm)

    Max size

    200 * 125

    200 * 125

    component thickness

    T≤15mm

    6.5mm<T≤15mm

    QFP,SOP,SOJ

    (multi pins)

    Min pin space

    0.4mm

    0.3mm≤Pitch<0.4mm

    CSP/ BGA

    Min ball space

    0.5mm

    0.3mm≤Pitch<0.5mm

    DIP

    Assembly

    PCB specification

    Length and Width( L* W)

    Minimum

    L≥50mm, W≥30mm

    L<50mm

    Maximum

    L≤1200mm, W≤450mm

    L≥1200mm, W≥500mm

    Thickness( T)

    Thinnest

    0.8mm

    T<0.8mm

    Thickest

    3.5mm

    T>2mm


    Advantages of DQS Team
    1. On-time Delivery:
      • Owned PCBA factories 15,000 ㎡
      • 13 fully automatic SMT lines
      • 4 DIP assembly lines

    2. Quality Guaranteed:

      • IATF, ISO, IPC, UL standards
      • Online SPI, AOI, X-Ray Inspection
      • The qualified rate of products reach 99.9%

    3. Premium Service:

      • 24H reply your inquiry
      • Perfect after-sales service system
      • From prototype to mass production

    Would you like details on ​​BGA rework​​ or ​​inspection techniques​​?

    Contact us via email : sales@dqspcba.com



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